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Remote Participation
Optimized Component Thermal Management and Mitigation Techniques in HPC Applications
Presenter
Event Type
Exhibitor Forum
Tags
Architectures
Green Computing
Registration Categories
TP
XO / EX
TimeWednesday, 17 November 20211:30pm - 2pm CST
Location263
DescriptionJoin Samtec as we discuss ideas and tricks of the trade for mitigating thermal issues in the component selection in HPC applications. Technical experts from Samtec will highlight the benefits to immersion cooling, routing signals over PCBs and low profile designs for high speed, high power applications. Selecting the correct component is part of the equation; how you apply that component in your application can give you the edge in getting the highest performance in next-generation HPC system design.
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