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Remote Participation
Addressing the Challenge of Efficient, Scalable and Green Thermal Management of Future High-Performance Computing
Event Type
Exhibitor Forum
Green Computing
Registration Categories
TimeWednesday, 17 November 20212pm - 2:30pm CST
DescriptionVarious global industries are in need of more efficient computational power in an ever-smaller footprint. To accommodate increasing demands, the power density of chips and their heat generation have increased beyond the practical limits of air cooling. Therefore, in high-density chips, alternative thermal management methods such as liquid cooling must be considered. 

Water or glycol-based coolants have the advantage of several times higher heat conductivity and specific heat capacity compared to air. This allows them to quickly absorb and carry large amounts of heat energy away from the densely packed transistors in modern chips. Such cooling capabilities enable the chips to stay cooler and run more efficiently, lowering the power consumption with the same workloads. From our observations of self-contained, fully liquid-cooled rack-mounted servers, there is a noticeable power consumption reduction when GPU and CPU cores are significantly below the thermal throttle limit.  

Chip transistor density is not the only challenge. Space in existing and newly built facilities is at a premium and strictly regulated. This translates into the need for increased server component density. Standard air cooling requires bulky fin stacks and heat pipe arrays with high-speed fans on high-power add-in boards. Replacing these fin stacks with purpose-built water blocks significantly reduces the total thickness and enables tighter spacing of the components.

We will also discuss the possibilities of better waste heat reuse in facility-level liquid cooling systems, lowering the overall environmental impact of HPCs. 
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